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RTA - Rapid Thermal Annealing System

Product Detail Information

FA-RTP can be profit for the processes that require minimization of process time and thermal buggets of substrated such as thin gate oxidation, rapid annealing of deposited film, etc.

Application

  • Generally, AM-OLED, TFT-LCD, Low-K dielectrics, post implanting annealing, semi-conductor fabrication.

Technology

  • Optimized hardware and temperature control
  • Excellent temperature uniformity
  • Capability of alternative ATM & vacuum process
  • 2~4 inch wafer mountable
  • Bench top type of compact design (L700mm x W400mm x D450mm)

Specification

  • 1 rectangular type process vacuum chamber
  • water cooling for chamber wall /radiation shield
  • Ni-Au surface coating for reflector
  • O-ring sealed sliding door
  • Double side radiation heating with halogen lamp
  • Ramping ratio of temperature : heating up to 1,000 °C
  • Temperature uniformity : Ø2% on 4 inch wafe
  • Programmable temp. controller
  • 2~4 inch wafer mountable
  • Low vacuum pumping system
  • Up to three(3) gas lines
  • User friendly PLC control with touch panel